Modulus of resilience is: Slope of elastic portion of stress – strain curve Area under the elastic portion of the stress –strain curve Energy absorbed during fracture in a tension test Energy absorbed during fracture in an impact test Slope of the plastic portion of the stress- strain curve                         (   ) Fatigue failure occurs under the condition of: High elastic stress

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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Modulus of resilience is:

  • Slope of elastic portion of stress – strain curve
  • Area under the elastic portion of the stress –strain curve
  • Energy absorbed during fracture in a tension test
  • Energy absorbed during fracture in an impact test
  • Slope of the plastic portion of the stress- strain curve                         (   )

Fatigue failure occurs under the condition of:

  • High elastic stress
  • High corrosivity
  • High stress fluctuations
  • High temperature
  • High rate of loading                                                                                     (   )

 

Creep failure of a material occurs most rapidly when the operating temperature is:

  • Cryogenic temperature
  • Equal to its melting point
  • Grater than 0.4 times its melting point in K
  • Greater than 200 oF
  • Close to boiling point                         (   )

 

Young’s modulus of a material is indicative of its:

  • Tensile strength
  • Yield Strength
  • Ductility
  • Stiffness
  • Corrosion Resistance                                                 (   )

 

 

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